Thermal Conductive Pad
3.0 W/m·K, soft interface
The Thermal Conductive Pad is a 3.0 W/m·K, soft interface. We mold it by HCR compression in a Shore A 20–50 compound, holding ±0.10 mm across production lots, and it complies with UL 94 V-0 · RoHS · REACH · 3.0 W/m·K. Typical minimum order is 1,000 pcs; series lead time is 16 days.
A ceramic-filled silicone gap pad that conforms to uneven surfaces at low pressure, giving a stable thermal path without stressing the component it touches.
- 3.0 W/m·K conductivity
- Conforms at low pressure
- Multiple thicknesses from stock tooling
Specification
| Hardness | Shore A 20–50 |
|---|---|
| Service temperature | -60–200 °C |
| Achievable tolerance | ±0.10 mm |
| Molding process | HCR compression |
| Typical MOQ | 1,000 pcs |
| Lead time | 16 days |
Compliance
- UL 94 V-0
- RoHS
- REACH
- 3.0 W/m·K